The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to research into design tools, processes, and design automation. The manufacturing process involves not only the most common manufacturing steps like deposition, photoresist, lithography, etch, ionization, and packaging, but also measurement and inspection, testing, and much more.
This course introduces the microelectronics manufacturing processes commonly used in chip mass production, from the fabrication of a silicon wafer to the packaging process, and focuses on the complex high-technology machinery needed to achieve work in this nanoworld. Students will learn the state of the art and future challenges in manufacturing and measurement. Theoretical and practical aspects will be introduced to get a complete technical overview of the manufacturing processes.
| COURSE TITLE | Basics of microelectronics manufacturing processes |
| COURSE PLATFORM | Moodle |
| COURSE WEB | http://ecovem.ieectqai.uned.es/moodle2/ |
| ACCESS INFORMATION | Self-registration. Previously students must create an account in the Moodle platform |
| PROVIDER INSTITUTION | UNED |
| PROVIDER CONTACT | name: Felix Garcia-Loro email: fgarcialoro@ieec.uned.es |
| TEACHERS | T1- Manuel Castro T2- Felix Garcia-Loro T3- Elio SanCristobal T4- Rosario Gil Ortego T5- Miguel Angel Arcos |
| TYPE OF COURSE | ☒ On-line (stand-alone) |
| DATES EXPECTED OPENING | October 1st, 2023 |
| DATES AVAILABILITY | ☒ 365 days accessible |
| WORKLOAD STUDENT | 250 hours |
| ECTS | 10 |
| ECVET points | 10 |
| TYPE OF TRAINING | ☒ Continuous VET |
| EQF LEVELS | ☒ EQF 4 ☒ EQF 5 |
| LANGUAGES | ☒ English |
| MAIN SUBJECT | ☒ Design and manufacture of PCB ☒ Microelectronics packaging technologies ☒ Fundamentals of microelectronics manufacturing |
| COURSE DESCRIPTION | The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to research into design tools, processes, and design automation. The manufacturing process involves not only the most common manufacturing steps like deposition, photoresist, lithography, etch, ionization, and packaging, but also measurement and inspection, testing, and much more. This course introduces the microelectronics manufacturing processes commonly used in chip mass production, from the fabrication of a silicon wafer to the packaging process, and focuses on the complex high-technology machinery needed to achieve work in this nanoworld. Students will learn the state of the art and future challenges in manufacturing and measurement. Theoretical and practical aspects will be introduced to get a complete technical overview of the manufacturing processes. |
| KEYWORDS | KW1 – Microelectronics KW2 – Manufacturing KW3 – Nano-fabrication KW4 – Photolithography KW5 – Etching |
| LEARNING OBJECTIVES | LO1 – understand microelectronics technology and materials required to manufacture an integrated circuit. LO2 – understand and be able to define microelectronic processes required to manufacture an integrated circuit. LO3 – understand and identify microelectronic tools. LO4 – understand and identify machinery, ancillary processes, and utilities that apply to a microelectronics factory. LO5 – understand and identify standards, patents, and regulations that apply to a microelectronics factory. |