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Bridge the Gap: Photovoltaic Systems
Photovoltaic effect was known since early years of XX century, but Photovoltaic technology was only used as a last option and only for remote projects such as satellites where no other source or energy was available. During last decade of XXth century and thanks to the continuously decreasing price of PV panels, photovoltaic systems were […]
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Basics of microelectronics manufacturing processes
The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to […]
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Foundations on Microelectronics
Microelectronics is a technology that is present in almost every aspect of our modern lives: PCs, smartphones, smartwatches, TVs, home appliances, etc. All those commodities that we have and use in daily basis, and we cannot imagine anymore a life without them are basically composes by many electronic components and microelectronic systems. Microelectronics is also […]
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Microelectronics for Space applications
For systems engineers today, a good practical knowledge in electronics is inevitable to ensure good project interoperability. The course will cover important skills in electronics using a hands-on approach. In addition, specific space related aspects of electronics are covered. The module gives the student the basics of space communication and remote sensing with spacecraft. Several […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
