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Basics of microelectronics manufacturing processes
The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to […]
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Microelectronics for Space applications
For systems engineers today, a good practical knowledge in electronics is inevitable to ensure good project interoperability. The course will cover important skills in electronics using a hands-on approach. In addition, specific space related aspects of electronics are covered. The module gives the student the basics of space communication and remote sensing with spacecraft. Several […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
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PCB Design, Assembling and Packaging
Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main […]
