Microelectronics packaging technologies

  • Basics of microelectronics manufacturing processes

    Basics of microelectronics manufacturing processes

    The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to […]

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  • PCB Design, Assembling and Packaging

    PCB Design, Assembling and Packaging

    Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad,  Altium and Proteus. Course includes main […]

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