Key microelectronic packaging technologies are studied, including:
- Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM;
- Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages;
- Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends
- PCB design, assembling and packaging
The course also includes the wire bonding techniques – gold ball bonding and aluminium wedge bonding. The techniques for heat removal and monitoring in the packages are discusses as well.
| COURSE TITLE | Microelectronics Packaging Technologies |
| COURSE PLATFORM | Moodle |
| COURSE WEB | https://moodle-tus.ecovem.eu/ |
| ACCESS INFORMATION | Self-registration. Previously students must create an account in the Moodle platform |
| PROVIDER INSTITUTION | Technical University of Sofia (TUS) |
| PROVIDER CONTACT | name: Prof. DsC Slavka Tzanova email: slavka.tzanova@tu-sofia.bg |
| TEACHERS | T1- Assist. Prof. Nina Spasova T2- Assist. Prof. Nikolay Kurtev |
| TYPE OF COURSE | ☒ On-line (stand-alone) ☒ On-site training ☒ Hybrid on-site/on-line |
| DATES EXPECTED OPENING | February 2023 |
| DATES AVAILABILITY | ☒ 365 days accessible for the on-line course ☒ Other (specify): during the summer semester for the hybrid mode of delivery with laboratory practice |
| WORKLOAD STUDENT (in hours) | 180 hours |
| TYPE OF TRAINING | ☒ Initial VET ☒ Continuous VET |
| EQF LEVELS | ☒ EQF 4 ☒ EQF 5 ☒ EQF 6 ☒ EQF 7 |
| LANGUAGES | ☒ English ☒ Others (specify): English, Bulgarian and French for hybrid delivery |
| MAIN SUBJECT | ☒ Microelectronics packaging technologies ☒ Fundamentals of microelectronics manufacturing |
| COURSE DESCRIPTION | Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM;Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages;Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging TrendsPCB design, assembling and packaging The course also includes the wire bonding techniques – gold ball bonding and aluminium wedge bonding. The techniques for heat removal and monitoring in the packages are discusses as well. |
| KEYWORDS | K1- Мicroelectronics packaging K2- Мulti-chip modules K3- Single-chip packages K K4- Stack packaging К5- Bonding techniques K6- Heat removal |
| LEARNING OBJECTIVES | LO1- Key microelectronic packaging technologies LO2- Principles the main mounting techniques LO3- Using different bonding techniques LO4- Design, fabrication and application of main types of multichip modules LO5- Manage the heat transfer in microelectronic packages |
| PREREQUISITES | P1- For operators with EQF4 and 5 no specific background is required P2- Microelectronics design and technologies |