Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main assembling and mounting techniques for PCB. The main difference between through-hole pads and SMD pads are described with their advantages and disadvantages. In course are explained fabrication process steps for single and multi-layer PCB design with via used for connection between layers and better heat transfer. In course are introduced basic sanity tests which final product should be able to pass after is been placed in designed enclosure.
| COURSE TITLE | PCB Design, Assembling and Packaging |
| COURSE PLATFORM | Moodle |
| COURSE WEB | https://moodle-tus.ecovem.eu/ |
| ACCESS INFORMATION | Self-registration. Previously students must create an account in the Moodle platform |
| PROVIDER INSTITUTION | Technical University of Sofia (TUS) |
| PROVIDER CONTACT | name: Assoc. Prof. Svetozar Andreev email: Svetozar_ka@abv.bg |
| TEACHERS | T1- Assist. Prof. Nina Spasova T2 – Assoc. Prof. Svetozar Andreev |
| TYPE OF COURSE | ☒ On-line (tutored) ☒ On-site training ☒ Hybrid on-site/on-line |
| DATES EXPECTED OPENING | February 2023 |
| DATES AVAILABILITY | ☒ 365 days accessible ☒ Other (specify): during the summer semester for the hybrid mode of delivery with laboratory practice |
| WORKLOAD STUDENT (in hours) | 180 hours |
| TYPE OF TRAINING | ☒ Initial VET ☒ Continuous VET |
| EQF LEVELS | ☒ EQF 3 ☒ EQF 4 ☒ EQF 5 ☒ EQF 6 |
| LANGUAGES | ☒ English ☒ Others (specify): English, Bulgarian and French for hybrid delivery |
| MAIN SUBJECT | ☒ Design and manufacture of PCB ☒ Microelectronics packaging technologies ☒ Fundamentals of microelectronics manufacturing |
| COURSE DESCRIPTION | Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main assembling and mounting techniques for PCB. The main difference between through-hole pads and SMD pads are described with their advantages and disadvantages. In course are explained fabrication process steps for single and multi-layer PCB design with via used for connection between layers and better heat transfer. In course are introduced basic sanity tests which final product should be able to pass after is been placed in designed enclosure. |
| KEYWORDS | K1- PCB design K2- PCB fabrication K3- Assembling K4- Packaging |
| LEARNING OBJECTIVES | LO1- Main assembling and mounting techniques for PCB LO2- PCB design principles LO3- Design of PCB with different software LO4- Understand the technologies for PCB fabrication LO5- Test of PCB |
| PREREQUISITES | P1- For operators with EQF3 and 4 no specific background is required P2- Electronic circuits design, analysis and simulation, |