E-learning in autonomy

  • Fabrication of Silicon Microsystems with Piezo-resistive Feedback

    Fabrication of Silicon Microsystems with Piezo-resistive Feedback

    Microsystems deal with the miniature mechanical mechanisms with embedded electronic elements fabricated by technologies similar to microelectronics. The synergy between fabrication technology and design will be demonstrated on various devices with piezo-resistive feedback.  Based on device specifications this course addresses the whole development cycle, incl. selection of materials and exploitable technology, as well as the […]

    View course

  • Microelectronics Packaging Technologies

    Microelectronics Packaging Technologies

    Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]

    View course

  • PCB Design, Assembling and Packaging

    PCB Design, Assembling and Packaging

    Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad,  Altium and Proteus. Course includes main […]

    View course