E-learning in autonomy

  • Microelectronics Packaging Technologies

    Microelectronics Packaging Technologies

    Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]

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  • PCB Design, Assembling and Packaging

    PCB Design, Assembling and Packaging

    Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad,  Altium and Proteus. Course includes main […]

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