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C++ for Automotive Electronics
This work-based course is teaching embedded C++, C++ advanced techniques and their use in Bosch applications for automotive electronics programming. COURSE TITLE C++ for Automotive Electronics COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and Bosch ECS PROVIDER CONTACT name: Prof. Slavka […]
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Embedded Systems for Automotive Industry
This work-based course is teaching embedded system design and their use in Bosch applications for automotive electronics. COURSE TITLE Embedded Systems for Automotive Industry COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and Bosch ECS PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg […]
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Test Engineering for Automotive Electronics
This work-based course is teaching embedded system design and their use in Bosch applications for automotive electronics. COURSE TITLE Test Engineering for Automotive Electronics COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and Bosch ECS PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg […]
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CMOS technology process
This work-based course is teaching the basic processes in microelectronics technology COURSE TITLE CMOS technology process COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and MELEXIS Bulgaria PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg TEACHERS T1- Prof. Slavka TzanovaT2 – Experts from […]
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Fabrication, characterization and ageing of photovoltaic (PV) modules: Theory and technological responses
In order to reach a decarbonized World energy mix by mid-century, solar photovoltaic (PV) systems have to be massively deployed within the next years and decades. Consequently, the industrial production of PV modules is already experiencing a tremendous growth, with part of the production being re-located in Europe. Accordingly, industry and research sectors are very […]
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Manufacturing standard silicon photovoltaic (PV) cells: Theory and technological responses
 As solar photovoltaic (PV) energy will become one of main sources in the decarbonized World energy mix of next mid-century, the industrial production of PV cells should experience a tremendous growth within the next years, with part of the production being re-located in Europe. In this context, highly skilled profiles in PV are of great […]
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Design of ICs with CADENCE
Problems related to the design and investigation of submicron and nanoscale MOS integrated circuits are covered by this course. Currently there are some nanotechnologies in the means of 14 nm design kits, which are available via the EUROPRACTICE organization. The main attention is drawn to the theoretical and practical usage of state-of-the-art industrial CAD systems, […]
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FPGA Design and Fabrication
The aim of this course is the students to acquire proficiency with Field Programmable Gate Arrays (FPGA) and skills to creating prototypes or products for a wide variety of applications. Course covers whole process and steps needed to develop, design, simulate and program an FPGA chip. The modules, included in the course are introduction in […]
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Fabrication of Silicon Microsystems with Piezo-resistive Feedback
Microsystems deal with the miniature mechanical mechanisms with embedded electronic elements fabricated by technologies similar to microelectronics. The synergy between fabrication technology and design will be demonstrated on various devices with piezo-resistive feedback. Based on device specifications this course addresses the whole development cycle, incl. selection of materials and exploitable technology, as well as the […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
