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Test Engineering for Automotive Electronics
This work-based course is teaching embedded system design and their use in Bosch applications for automotive electronics. COURSE TITLE Test Engineering for Automotive Electronics COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and Bosch ECS PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg […]
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CMOS technology process
This work-based course is teaching the basic processes in microelectronics technology COURSE TITLE CMOS technology process COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and MELEXIS Bulgaria PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg TEACHERS T1- Prof. Slavka TzanovaT2 – Experts from […]
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Fabrication of Silicon Microsystems with Piezo-resistive Feedback
Microsystems deal with the miniature mechanical mechanisms with embedded electronic elements fabricated by technologies similar to microelectronics. The synergy between fabrication technology and design will be demonstrated on various devices with piezo-resistive feedback. Based on device specifications this course addresses the whole development cycle, incl. selection of materials and exploitable technology, as well as the […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
