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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
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LoraWan technology
The LoraWan course offers a complete curriculum for VET students and professionals interested in Internet of Things and creating long- range IoT solutions. By completing this course, the students will develop a strong understanding of the fundamentals that make Lora radio modulation and how to design, build and deploy LoraWan networks. This course delivers knowledge […]