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Fabrication, characterization and ageing of photovoltaic (PV) modules: Theory and technological responses
In order to reach a decarbonized World energy mix by mid-century, solar photovoltaic (PV) systems have to be massively deployed within the next years and decades. Consequently, the industrial production of PV modules is already experiencing a tremendous growth, with part of the production being re-located in Europe. Accordingly, industry and research sectors are very […]
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Manufacturing standard silicon photovoltaic (PV) cells: Theory and technological responses
 As solar photovoltaic (PV) energy will become one of main sources in the decarbonized World energy mix of next mid-century, the industrial production of PV cells should experience a tremendous growth within the next years, with part of the production being re-located in Europe. In this context, highly skilled profiles in PV are of great […]
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Design of ICs with CADENCE
Problems related to the design and investigation of submicron and nanoscale MOS integrated circuits are covered by this course. Currently there are some nanotechnologies in the means of 14 nm design kits, which are available via the EUROPRACTICE organization. The main attention is drawn to the theoretical and practical usage of state-of-the-art industrial CAD systems, […]
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FPGA Design and Fabrication
The aim of this course is the students to acquire proficiency with Field Programmable Gate Arrays (FPGA) and skills to creating prototypes or products for a wide variety of applications. Course covers whole process and steps needed to develop, design, simulate and program an FPGA chip. The modules, included in the course are introduction in […]
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Fabrication of Silicon Microsystems with Piezo-resistive Feedback
Microsystems deal with the miniature mechanical mechanisms with embedded electronic elements fabricated by technologies similar to microelectronics. The synergy between fabrication technology and design will be demonstrated on various devices with piezo-resistive feedback. Based on device specifications this course addresses the whole development cycle, incl. selection of materials and exploitable technology, as well as the […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
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Computer modelling and simulation in Analogue electronics
The aim of this training course is to provide the necessary knowledge and skills for simulation and modeling of analog electronic circuits through SPICE simulator. The free Analog Devices LTSpice simulator is used to simulate the circuits. The Performance-centered approach is used to implement the course, and for each topic a task description is defined, […]
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LoraWan technology
The LoraWan course offers a complete curriculum for VET students and professionals interested in Internet of Things and creating long- range IoT solutions. By completing this course, the students will develop a strong understanding of the fundamentals that make Lora radio modulation and how to design, build and deploy LoraWan networks. This course delivers knowledge […]