-
Bridge the Gap: Photovoltaic Systems
Photovoltaic effect was known since early years of XX century, but Photovoltaic technology was only used as a last option and only for remote projects such as satellites where no other source or energy was available. During last decade of XXth century and thanks to the continuously decreasing price of PV panels, photovoltaic systems were […]
-
Basics of microelectronics manufacturing processes
The most relevant processes related to microelectronics technology are design and manufacturing. The entire process of creating a silicon wafer with working chips consists of thousands of steps and can take more than three months from design to production. The design process includes all aspects of microelectronics design, from the development of novel designs to […]
-
SEMI Standards Educational Series for E10 and E79
SEMI E10 and SEMI E79 are the two most widely used equipment performance metrics Specification Standards in the semiconductor and other related high-tech areas. SEMI E10 provides the methodologies needed for measuring and evaluating equipment reliability, availability, and maintainability (RAM) and utilization performance. SEMI E79 provides the methodologies needed for measuring and evaluating the productivity […]
-
Voltage Sag for Manufacturing Fabs Overview
SEMI F47, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, widely adopted across the industry, is the governing standard that defines voltage sag test levels and requirements for semiconductor tools. Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to single-phase and two-phase voltage sags has improved greatly. However, semiconductor manufacturers continue to […]
-
Microelectronics for Space applications
For systems engineers today, a good practical knowledge in electronics is inevitable to ensure good project interoperability. The course will cover important skills in electronics using a hands-on approach. In addition, specific space related aspects of electronics are covered. The module gives the student the basics of space communication and remote sensing with spacecraft. Several […]
-
Fabrication of Silicon Microsystems with Piezo-resistive Feedback
Microsystems deal with the miniature mechanical mechanisms with embedded electronic elements fabricated by technologies similar to microelectronics. The synergy between fabrication technology and design will be demonstrated on various devices with piezo-resistive feedback. Based on device specifications this course addresses the whole development cycle, incl. selection of materials and exploitable technology, as well as the […]
-
Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
-
PCB Design, Assembling and Packaging
Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main […]
