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CMOS technology process
This work-based course is teaching the basic processes in microelectronics technology COURSE TITLE CMOS technology process COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and MELEXIS Bulgaria PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg TEACHERS T1- Prof. Slavka TzanovaT2 – Experts from […]
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Design of ICs with CADENCE
Problems related to the design and investigation of submicron and nanoscale MOS integrated circuits are covered by this course. Currently there are some nanotechnologies in the means of 14 nm design kits, which are available via the EUROPRACTICE organization. The main attention is drawn to the theoretical and practical usage of state-of-the-art industrial CAD systems, […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
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PCB Design, Assembling and Packaging
Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main […]
