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Test Engineering for Automotive Electronics
This work-based course is teaching embedded system design and their use in Bosch applications for automotive electronics. COURSE TITLE Test Engineering for Automotive Electronics COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and Bosch ECS PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg […]
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CMOS technology process
This work-based course is teaching the basic processes in microelectronics technology COURSE TITLE CMOS technology process COURSE PLATFORM Work-based COURSE WEB https://www.bosch.bg/our-company/bosch-in-bulgaria/ecs/ ACCESS INFORMATION Hybrid: at TUS and in company training PROVIDER INSTITUTION Technical University of Sofia (TUS) and MELEXIS Bulgaria PROVIDER CONTACT name: Prof. Slavka Tzanova email: Slavka.tzanova@tu-sofia.bg TEACHERS T1- Prof. Slavka TzanovaT2 – Experts from […]
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Microelectronics for Space applications
For systems engineers today, a good practical knowledge in electronics is inevitable to ensure good project interoperability. The course will cover important skills in electronics using a hands-on approach. In addition, specific space related aspects of electronics are covered. The module gives the student the basics of space communication and remote sensing with spacecraft. Several […]
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Fabrication of Silicon Microsystems with Piezo-resistive Feedback
Microsystems deal with the miniature mechanical mechanisms with embedded electronic elements fabricated by technologies similar to microelectronics. The synergy between fabrication technology and design will be demonstrated on various devices with piezo-resistive feedback. Based on device specifications this course addresses the whole development cycle, incl. selection of materials and exploitable technology, as well as the […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
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PCB Design, Assembling and Packaging
Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main […]
