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Microelectronics for Space applications
For systems engineers today, a good practical knowledge in electronics is inevitable to ensure good project interoperability. The course will cover important skills in electronics using a hands-on approach. In addition, specific space related aspects of electronics are covered. The module gives the student the basics of space communication and remote sensing with spacecraft. Several […]
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Microelectronics Packaging Technologies
Key microelectronic packaging technologies are studied, including: Multi-chip modules (MCM) – three major technologies (MCM-L, MCM-C, MCM-D) and methods for via metallization in MCM; Single-chip packages – Ball Grid Array, Column Grid Array, Land Grid Array, Chip Scale Package, Wafer Level Packages; Stack packaging – Package-on-Package (PoP), Package-in-Package (PiP), 2.5D/3D TSV Packaging Trends PCB design, […]
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PCB Design, Assembling and Packaging
Course covers whole process and steps needed to be produced Printed Circuit Board. Modules which are included are schematics design, component selection, printed circuit board design, simulation, final housing of the produced PCB in appropriate case and testing of final product. Software products introduced in the course are Kicad, Altium and Proteus. Course includes main […]
